ESWEEK Logo ESWEEK 2014 Logo

ESWEEK General Chairs

  • Karam S Chatha, Qualcomm Research, USA
  • Rolf Ernst, TU Braunschweig, Germany

ESWEEK Conference Program Chairs

CASES:
  • Anand Raghunathan, Purdue University, USA
  • Ravishankar Iyer, Intel, USA
CODES+ISSS:
  • Radu Marculescu, Carnegie Mellon University, USA
  • Gabriela Nicolescu, Polytechnique Montreal, Canada
EMSOFT:
  • Tulika Mitra, National University of Singapore, Singapore
  • Jan Reineke, Saarland University, Germany

ESWEEK Local Arrangement Chairs

  • Preeti Ranjan Panda, IIT Delhi, India
  • Anshul Kumar, IIT Delhi, India

ESWEEK Steering Committee

Past Chair:
  • Luca Carloni, Columbia University, USA
CASES:
  • Joerg Henkel, Karlsruhe Institute of Technology, Germany
  • Vinod Kathail, Xilinx, USA
CODES+ISSS:
  • Nikil Dutt, University of California, Irvine, USA
  • Petru Ion Eles, Linkoping University, Sweden
EMSOFT:
  • Christoph Kirsch, University of Salzburg, Austria
  • Wang Yi, Uppsala University, Sweden

ESWEEK Organizational Chairs

Finance Chairs:
  • Sudeep Pasricha, Colorado State University, USA
  • Sanjiv Narayan, Calypto Design Systems, India
Publication Chair:
  • Brett Meyer, McGill University, Canada
Web Chairs:
  • Aviral Shrivastava, Arizona State University, USA
  • Namita Sharma, IIT Delhi, India
Publicity Chair (Europe):
  • Lars Bauer, Karlsruhe Institute of Technology, Germany
Publicity Chair (North America):
  • Roman Lysecky, University of Arizona, USA
Tutorials Chair:
  • Alessandro Pinto, UTRC, USA
Workshop Chair:
  • Prabhat Mishra, University of Florida, USA
ESTIMedia Symposium General Chair:
  • Maurizio Palesi, Kore University, Italy.
Local (India) Industry Liaison:
  • S. Uma Mahesh
Industry Liaison (North America):
  • Ramesh Chandra, Qualcomm Research

ESWEEK Professional Society Liaisons

ACM SIGBED Liaison:
  • Christoph Kirsch, University of Salzburg, Austria
ACM SIGDA Liaisons:
  • Naehyuck Chang, KAIST, Korea
  • Sri Parameswaran, UNSW, Australia
ACM SIGMICRO Liaison:
  • Pradip Bose, IBM, USA
IEEE CEDA/CAS Liaison:
  • David Atienza Alonso, EPFL, Switzerland
IEEE CS Liaison:
  • Alex Orailoglu, University of California, San Diego, USA
IFIP Liaison:
  • Marilyn Wolf, Georgia Tech, USA

Important Dates

  • Notification of Paper Acceptance
    June 27, 2014

  • Camera-ready version
    August 01, 2014

  • Early Registration Deadline
    Sept. 12, 2014 Sept. 19, 2014

  • Conference
    Oct. 12-17, 2014

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